Welcome to the The Battery Show and Electric & Hybrid Vehicle Technology Digital Days Conference Session Viewer. Browse and sort the growing list of sessions by day, time, pass type, topic, or format. All session times are shown in Eastern Time, except 3rd day (November 12th) EU Conference Pass sessions are in Central European Time. Check out the event Conference Page for more information related to the event schedule. Register for Digital Days and login to the event platform to begin bookmarking sessions, building your schedule, and accessing whitepapers.
Andreas Hinrich (Dipl.-Ing. , Heraeus Electronics)
Date: Wednesday, November 11
Time: 9:30am - 10:30am
Pass Type: Virtual Conference Pass (Paid), Virtual Conference Pass + EU (Paid), Virtual EU Conference Pass (Paid), Virtual Expo Pass (Free)
Format: Sponsored Session (Free)
Vault Recording: TBD
Audience Level: All
Highly reliable packaging and interconnection technology in power modules: thick copper wire bonding on power semiconductors with the Die Top System (DTS®)
In modern power modules, assembly and connection technology is becoming increasingly important. Progress in the development and improvement of chip technology – especially silicon carbide power semiconductors – leads to faster switching frequencies, lower switching losses, higher power densities and allows operation at much higher junction temperatures. At the same time, the reduction in chip size allows a reduction in the size of a package, which in turn increases the demands on packaging and interconnection technology. Low temperature sintering is a suitable technology for the highly reliable contacting of semiconductors on a substrate or of entire packages on a heat sink
This presentation shows highly reliable technologies for contacting the top side of a semiconductor using the Die Top System in combination with ultrasonic bonding of Cu wires. The reliability of the new connection is demonstrated using the results of Power Cycling tests. The importance of the sinter process and possible errors in module assembly with the Die Top System, especially in wire bonding, will be discussed.